• Features & Benefits
  
• Eutectic alloy (liquidus = solidus temperature)
• Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
• Flux meets J-STD-004B
• Spreads like rosin-activated flux
• Virtually non-splattering
• Non-corrosive residue
• Non-conductive residue
• Halide free

4860–4865 Sn63/Pb37 No-Clean Solder Wires is electronics grade solder wire. This no-clean solder wire uses the standard eutectic tin-to-lead alloy ratio, which is complemented by a no-clean, synthetically refined, splatter-proof, resin flux core. It meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. 63/37 solder wire is one of the easiest solders to work with because it combines a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.

This leaded solder achieves a consistent solder and flux percentage thanks to our state-of-the-art extrusion wire-drawing machine, which continuously monitors the wire to prevent voids and ensure consistency, resulting in a top-grade solder wire.