• VOC-Free per ASTM D3960-98
• Passes IPC J-STD-004B
• Broad Process Window
• Withstands Extended Dwell Time
• Fast Wetting
• REACH/RoHS Compliant
• Low Post-Soldering Residue

NC275LR is a water-based, halide-free, no-clean liquid flux formulated to offer a wide process window with excellent wetting even on hard-to-wet and OSP surfaces. NC275LR offers a durable activator system accommodating a variety of process parameters and applications, including soldering with tin-silver-copper, tinsilver, tin-copper, and other lead free alloys. In addition, NC275LR is a low-odor, low-fume flux and provides rapid solvent evaporation. NC275LR is safe for palletized selective wave soldering and point-to-point selective soldering. NC275LR residues may be left on the circuit board after processing; residue removal is not required.