• 120V for the U.S.A., Canada & Mexico
• Easy-to-Operate
• Big LED digital display, not tiny eye-straining LCD displays
• Excels with RoHS Compliant, Lead-Free Solders
• Closed-loop feedback
• Digital temp control
• Digital countdown timer with audible beeper
• Unique, sliding & retractable heat-zone
• Auto-Lift de-soldering

The Zephyrtronics ZT-7000-120 is a comprehensive BGA & SMT hot air bench top reflow system and a 120 volt model for the U.S.A., Canada & Mexico.

Program Up to 31 Custom Thermal Profiles! The ZT-7 does not rely on do-it-yourself, unrepeatable, unreliable, external "taping" thermocouples to your PCB. Temperature control is integrated into the system with full closed-loop sensing. The easy-to-access front panel controller permits up to 31 custom thermal profiles with multiple ramp, soak and final solder reflow functions, all storable for different PCB's!

Preheat your chip from above while your PCB is also preheating below to speed up your process and for greater quality. You have control. The ZT-7 does not rely on unpredictable, unstable infrared (IR) for preheat or solder reflow, but utilizes the long-established and superior industry standard (60 years) of forced convection. The ZT-7 is the #1 PCB station for Smartphone, Laptop, Tablet and Flat Screen repair.

The easy-to-operate ZT-7 was developed for prototype work, low volume production, secondary operations, and rework of electronic printed circuit board assemblies (PCBA’s) at the bench for BGA, CSP and/or SMT components. All of the critical process controls "built in." The ZT-7 was engineered to eliminate need for compressed air hook-ups, air pressure settings, external fanning equipment, awkward foot pedals. There are no exposed air hoses or moving electrical cords as with other "systems". The ZT-7 is a fully-integrated, digital system for meticulous, thermal profiles just like those in high volume production equipment with temperature ramp, preheat, soaking, solder reflow and cooling.

The ZT-7 features closed-loop feedback, digital temp control; a digital countdown timer with audible beeper for process and profile uniformity; a heating zone with the unique capacities of both 1.) a "Z-Axis" which raises and lowers the heating zone to the targeted chip; and 2.) a "Y-Axis" that retracts and returns the heat zone before and after soldering so technicians can align, flux, prep, clean, inspect without a heat zone in their face. (Both Z and Y axis are on precision linear bearing for smooth, accurate and repeatable travel.)

The ZT-7 heat zone travels to the targeted chip unlike other BGA "machines" with functionally-fixed heat zones. Technicians can prep, solder, desolder, clean and inspect their PCB without moving the board. David Jacks, president of Zephyrtronics, introduced this concept to the world in the early 1980's. The ZT-7 slidable heat zone rides on precision ball bearings, not cheap, jerky kitchen door slides on other "machines".

From high reliability applications (space, military and medical) to even rework of commercial video game consoles like the XBOX360® or PlayStation® or smart-phones, tablets, laptops, flat-screens and forensics, the ZT-7 is at work even as you read this around the globe.

With the exclusive and patent protected Single-Spot, Single Axis Alignment, Placement & Reflow. The ZT-7 System NEVER requires moving the PCB once your BGA or SMD is aligned and placed and each ZT-7 ships with The BGA Primer for how to quickly and precisely align and place BGA’s to substrate pads and how NASA "explains" this simple method of placing BGA's to pads. and how to redress pads without solder wick.

For de-soldering and removing chips, a semi-automatic spring-activated vacuum probe lifts BGA's and SMD's up off a PCB as solder melts taking out the guesswork -- so you won't lift pads. When the solder melts, the chip pops up into the nozzle!

Forced Hot Air Convection is Superior to IR for PCB Prototyping, Rework & Repair: There are many problems with infrared (IR) for PCB's, which is why it really never caught on and why so many of these "systems" have been relegated to landfills. Some drawbacks (many enumerated in articles and white papers at electronic expos) range from serious chip shadowing and lack of true thermal ramping because repeatable temperature control is not likely with IR. IR "systems" depend on technician guess work, including an idiotic requirement of taping thermocouples to your PCB to achieve sensing feedback. But the ZT-7 has built-in, closed-loop, temperature sensing during both preheat and solder reflow. No "taping" of thermocouples or using aluminum foil is required.

The ZT-7 is not limited to only surface mount devices, but excels with difficult thru-hole (PTH) de-soldering tasks with connectors, sockets, metal shields and PGA's. So versatile!