Technomelt 1066640 Hot Melt Adhesive

Black, 1-part, polyamide hot melt adhesive ideal for outdoor molding applications, typically for potting electronics modules, molding strain relief into wiring and encapsulation of sensors. It’s compatible with many substrates, formulated with improved UV stability, and is typically used for low-pressure moldings. Due to its low viscosity, it allows encapsulation of fragile components without damage. With an operating temperature range of -40°C to 130°C (-40°F to 266°F), TECHNOMELT PA 6481 is designed to be used with a hotmelt application system. Its creep resistance temperature stands at 155°C (311°F); it resists temperature to a softening point of 170°C to 180°C (338°F to 356°F) and cures by physical setting to form a barrier between electronics and the environment.

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