The Molded Slimline Bottle capillaries (SBN) series is intended for fine pitch application for Bond Pad Pitch (BPP) 125µm up to as fine as 70µm. The results of various product qualifications have demonstrated the optimum face angle selection for most fine pitch bonding is the "E" or 11-deg. face. When the "T" is larger than 150µm, then the "S" or 8-deg. face angle is popular choice. The "Z" or 0-deg. face angle has found value for some specialized metallization. It also comes with a standard 30-deg. main taper angle (MTA) with an option of 50-deg. MTA- for wire bonder with higher frequency (100KHz) transducer. For BPP> 90µm, the standard material is typically high density ceramic material.

The integration of the new AZ composite material into Slimline Bottleneck (SBN) capillary has set a new milestone in the micro-packaging technology for application of ultra-fine pitch bonding. The higher strength SBN-AZ configuration is offered with T 110µm. Actual bonding results have demonstrated the versatility of this new AZ composite material for both leaded and substrate packaging platforms.