High-performance, electrically non-conductive thermal interface compound for power electronics

Overview

Pitel Paste AZ-01 is Magna-Power’s signature thermal paste formula, designed to satisfy the majority of semiconductor thermal interface requirements for power electronics manufacturers. AZ-01 finds the perfect balance among long-term thermal resistance, viscosity and cost.

Pitel Paste AZ-01 uses a mixture of high-concentration powderized aluminum and zinc oxide suspended in non-conducting silicone oil. This thermal paste formulation was designed specifically for power electronics applications, filling microscopic voids between semiconductors and heatsinks, resulting in a better thermal transfer and ultimately, improved performance capabilities. AZ-01, refined and validated over 8 years by Magna-Power, has a proven track record for delivering superior thermal performance in some of the most demanding power electronics applications.

A wide range of deposition methods are supported for a variety of production needs, including manual deposition, automated dispensing, pneumatic dispensing, and stencil printing.

Pitel Paste is manufactured in the USA at Magna-Power’s manufacturing facility and is compliant with both REACH and RoHS directives.

Thermal Paste in Power Electronics Applications

With internal capabilities that include metal and heatsink fabrication, CNC machined surface finishing, and power module assembly, Magna-Power is uniquely positioned to address power semiconductor heat extraction with a vertically integrated approach. Over a period of 8 years, Magna-Power iterated on its own thermal compound formulation, evaluating it through the lens of power electronics applications and today playing a critical role in the company’s ability to deliver among the most power dense programmable power supplies on the market.

A thermal interface material between two metals can offer up to two orders of magnitude drop in thermal resistance. A high-performing thermal paste can help achieve the highest-performing thermal bond on a production-scale.