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MG Chemicals
MG Chemicals

MG Chemicals 8331S-15G Silver Conductive Epoxy, High Conductivity, 4 Hour Pot Life, 15 g Syringes (Two Part)

Our Part #484-442

Condition:New

Mfr Part #8331S-15G

MG Chemicals 8331S-15G
MG Chemicals
MG Chemicals

MG Chemicals 8331S-15G Silver Conductive Epoxy, High Conductivity, 4 Hour Pot Life, 15 g Syringes (Two Part)

Our Part #484-442

Condition:New

Mfr Part #8331S-15G

Cannot Ship Air
$112.42EACH
Quantity on Order:1
Qty:Price:Savings
1$112.42
10$109.05Save 3%
20$106.80Save 5%
50$101.18Save 10%
100$98.93Save 12%
Cannot Ship Air
  • Good 0.0060 Ω·cm electrical resistivity and 0.95 W/(m·K) thermal conductivity
  • Easy 1:1 mix ratio and long working time
  • May be mixed once and then used as a 1-part epoxy for a four hour production shift
  • Optimal cure temperature of only 65 °C
  • Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons
  • Room temperature cure is possible (96 hours)
  • Excellent adhesion to most electronic substrates

The 8331S Silver Conductive Epoxy Adhesive: Slow Cure is an economical electronic grade epoxy that combines long working time and good conductivity with ease of use. It has a convenient 1-to-1 mix ratio and 4–5 hours pot life, which once mixed behaves essentially like a 1-part adhesive for the duration of a work shift. However, unlike 1-part adhesives that often require high heat (130–170 °C), it will cure at 65 °C in less than 2 hours. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies; resists thermal and mechanical shocks; and provides the low resistivity needed for many operating conditions. The 8331S epoxy adhesive is great for forming conductivity seals, bonding, and repairing of electronic devices.

Brand: MG Chemicals
Color: Silver Grey
Container Size: 15 g
Container Type: Syringes (Part A & B)
Applications: The 8331S epoxy has many uses in the production, repair and assembly of electronics in microelectronics and optoelectronics. It has been designed for production environments as a replacement for one part silver conductive epoxy systems when high cure temp
Cure Time: Full Cure @65° C (149° F) = 2 h
Features: The cured adhesive bonds very well to most substrates used in electronic assemblies; resists thermal and mechanical shocks; and provides the low resistivity needed for many operating conditions.
Mixing Ratio: 1:1
Resistivity: Volume: 0.0060 Ω.cm
Work Life: 4 h
$112.42EACH
Quantity on Order:1
Qty:Price:Savings
1$112.42
10$109.05Save 3%
20$106.80Save 5%
50$101.18Save 10%
100$98.93Save 12%