Kester Ultrapure K100LD Lead-Free Solder Bar Overview:

Note: Kester recently changed part #'s. 44-9574-0050 is equivalent to 04-9574-0050

In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure with the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.

Storage, Handling and Shelf Life

Storage must be in a dry, non-corrosive environment between 10 to 40 °C (50 to 104 °F). The surface may lose its shine and appear a dull shade of grey. This is a surface phenomenon and is not detrimental to product functionality. Solder bar has a shelf life determined by the alloy used in the bar. For alloys containing more than 70% lead, the shelf life is 2 years from the date of manufacture. Other alloys have a shelf life of 3 years from the date of manufacture.

Kester bar solder is now available and being sold by the individual bar. Each bar equals 1 2/3 lbs.