• Ribbon bonding wedge for gold and aluminum wire
• Front/Back radius: .0005 x .0005
• Foot type: Cross groove
• Ribbon size: .0005 thickness x .003 width
• Bond length: .0025
• Slot Width: .0034 x .0037
• Foot finish: Matte (FR, BR & Bond flat)
• A4 Front Step .375, A9 Back Chamfer MAX, S1 Option
• Polished funnel entrance & exit slot

DeWeyl's bonding wedge for microelectronics is designed for the placing and bonding of fine aluminum and gold wires during the assembly of integrated circuits. Ceramic offers a surface texture that couples with the wire giving optimum ultrasonic transfer. Difficult applications due to low bonding temperatures or a contaminated bond surfaces are made easier. It's used throughout the semiconductor, microwave, disk drive and hybrid electronic industries.