Our Part #701-775
Condition:New
Mfr Part #SN63-M8-T4-600C
Next Day Air Only
$204.40EACH
Qty: | Price: | Savings |
---|---|---|
1 | $204.40 | |
5 | $194.18 | Save 5% |
10 | $188.05 | Save 8% |
20 | $179.87 | Save 12% |
Next Day Air Only
- Description
- Specifications
- Documents
- Low Voiding: <5% on BGA and <10% on BTC
- Excellent Print Transfer Efficiencies <0.50 AR
- Eliminates HiP Defects
- REACH and RoHS* Compliant
- Formulated for use with T4 and Finer Powders
- Powerful Wetting on Lead-Free Surface Finishes
- Minimal Transparent Residue – LED Compliant
- Passes Bono and Automotive SIR Testing
M8 no clean solder paste brings performance to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for today’s UFP and umBGA devices, reducing DPMO on the most challenging applications. M8 activators will reduce wetting related defects such as HiP (head-in-pillow) and provide smooth shiny joints. M8 has reduced BGA and BTC voiding to as low as <5% on BGA and <10% on BTC ground pads. M8 passes stringent automotive and high reliability SIR and electrochemical test requirements.
Brand:Â AIM Solder
Flux Type:Â No Clean
Volume:Â 700 g
Package:Â 700g
Type:Â Solder Paste
$204.40EACH
Qty: | Price: | Savings |
---|---|---|
1 | $204.40 | |
5 | $194.18 | Save 5% |
10 | $188.05 | Save 8% |
20 | $179.87 | Save 12% |