Our Part #592-456
Condition:New
Mfr Part #RMA258-15R
Next Day Air Only
CA Prop 65
Next Day Air Only
Calif. Prop 65
- Description
- Specifications
- Documents
- Long Pause-to-Print Capabilities
- Excellent Wetting. Even Leadless Devices
- Enhances Fine Print Definitions
- Exceptional Reflow During Long, Hot Profiles
- ROL0 per IPC J-STD-004
- Reduced Voiding
RMA258-15R rosin based solder paste has been developed for assemblers of high reliability and military electronics. RMA258- 15R offer long pause-to-print capabilities even on miniaturized devices. RMA258-15R reduces voiding on BGA/BTC and eliminates head-in-pillow defects. Powerful activators in RMA258- 15R produce bright, smooth and shiny solder joints. RMA258-15R is capable of withstanding long hot reflow profiles common to high mass assemblies such as backplanes and power management. RMA258-15R residues have been formulated for removal in vapor degreaser, solvent and saponifed wash systems.
Brand:Â AIM Solder
Alloy:Â Sn63Pb37
Flux Type:Â Rosin
Lead Type:Â Leaded
Powder Mesh Size:Â T4
Package Type:Â Jar
Volume:Â 500 g
Composition:Â 63/37 (63% Tin, 37% Lead)
Lead Free:Â No
Package:Â 500g Jar
Type:Â Solder Paste