• Long Pause-to-Print Capabilities
• Excellent Wetting, Even Leadless Devices
• Reduces Voiding
• Low Post Process Residues
• RoHS Compliant
• Passes Bono Testing

NC258 has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 reduces voiding. The superior wetting ability of NC258 results in bright, smooth and shiny solder joints. It also offers very low post process residues, which remain crystal clear even at the elevated temperatures required for today’s lead-free alloys.